ALLOY FOR BONDING METALS TO CERAMICS,
Abstract
The report discusses the application of a titanium-base alloy containing nickel and silicon for bonding metal to ceramic materials. To reduce the bonding temperature and improve the bonds, beryllium is used as a partial or full substitute for silicon. In a variant, 0.1-2.0% beryllium or beryllium with silicon are added to alloy containing 24-36% nickel. To improve the mechanical properties of bonds, up to 10% copper is added to the alloy composition. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 10, 1969
- Accession Number
- AD0688288
Entities
People
- N. V. Solodonikova
- V. D. Saratovkin
Organizations
- United States Army Foreign Science and Technology Center