AN R.F. SPUTTERING SYSTEM FOR USE IN MICROCIRCUIT FABRICATION,
Abstract
A simple diode R.F. sputtering system is described which has been used to sputter amorphous quartz for thin film capacitors. The problem of feeding R.F. power to the gas discharge in the sputtering chamber, and some factors affecting chamber impedance are discussed. Deposition rates of quartz up to 150 pm/s have been achieved, and the distribution of deposit is shown to be determined mainly by current density variation across the axis of the discharge. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1969
- Accession Number
- AD0695258
Entities
People
- B. J. Franklin
- I. G. Carver