DISLOCATION DAMAGE IN TANTALUM AFTER CYCLIC LOADING,

Abstract

The dislocation distribution in tantalum foil after fatigue testing in the region of the yield point has been determined quantitatively using thin film electron microscopy. Changes in the measured micro-structural parameters as a function of stress level, test temperature and number of loading cycles have been related to a microscopic model of the fatigue process. The model leads to a consistent criterion for fatigue failure based on the gradual growth of impenetrable subboundary groups of immobile dislocations. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1969
Accession Number
AD0696154

Entities

People

  • David G. Brandon
  • Yigal Komem

Organizations

  • Technion – Israel Institute of Technology

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Dislocations
  • Electron Microscopy
  • Electrons
  • Films
  • Microscopy
  • Optical Analysis
  • Tantalum
  • Thin Films
  • Yield Strength

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics