THE CREEP AND FRACTURE BEHAVIOR OF Al-Al3Ni EUTECTIC WHISKER COMPOSITES.

Abstract

A series of Al3Ni eutectic creep specimens was fabricated from ingots solidified at 11.0 cm/hr and these specimens were creep tested at a single set of conditions to plastic strains in the first, second, and third stages of creep, and to rupture. The tests were then interrupted and the specimens were sectioned and examined by transmission electron microscopy. It was found that due to the small plastic strains encountered in the first and second stages (epsilon sub p = or < 0.3%) of creep, relatively little substructure buildup was encountered in these specimens. In specimens tested to rupture dense dislocation cells keyed on the whiskers were found. As a result, a time dependent fracture mechanism was identified which was quite different from normal tensile fracture, and this mechanism was related to the substructure buildup. Solidification experiments conducted at approximately 3.5 cm/hr resulted in the formation of a dual-orientation microstructure in which portions of the whiskers were misaligned from the nominal growth direction. This structure was found to be extremely detrimental to creep behavior. The modes by which premature specimen failure occurred were identified and the fracture mechanisms determined. Microstructural characterization studies were conducted on ingots solidified over a range of rates from 3.5 to 35 cm/hr. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1970
Accession Number
AD0702418

Entities

People

  • Earl R. Thompson
  • Edward M. Breinan
  • Gerald P. Mccarthy
  • Walter J. Hermann
  • Warren K. Tice

Organizations

  • United Aircraft Corporation

Tags

DTIC Thesaurus Topics

  • Composite Materials
  • Dislocations
  • Electron Microscopy
  • Electrons
  • Microscopy
  • Microstructure
  • Optical Analysis
  • Orientation (Direction)
  • Solidification
  • Transmission Electron Microscopy
  • Whisker Composites

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Metallurgy

Technology Areas

  • Microelectronics