PACKAGED CIRCUITS. VOLUME I.

Abstract

Selective references include: compatible techniques for integrated circuitry; results of studies to determine optimum packaging techniques for the electronic equipment and the shock levels that the different packages and certain electronic components could withstand; a system for computer-aided selection and assignment of electronic modules; an electronic packaging program was initiated to develop and evaluate integrated circuit packaging techniques applicable to unmanned scientific spacecraft data system; and all aspects of microcircuit packaging are studied and each of the three basic approaches to the packaging of microcircuits are investigated and evaluated, namely, type of containers, glass and metal flat packages, and encapsulated type packages. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1970
Accession Number
AD0704925

Entities

Organizations

  • Defense Technical Information Center

Tags

Communities of Interest

  • Advanced Electronics
  • Autonomy

DTIC Thesaurus Topics

  • Circuit Testers
  • Circuits
  • Electronic Components
  • Electronic Equipment
  • Integrated Circuits
  • Microcircuits
  • Modules (Electronics)
  • Packaged Circuits
  • Packaging
  • Spacecraft
  • Test Equipment

Fields of Study

  • Engineering

Readers

  • Materials Science
  • Software Engineering

Technology Areas

  • Autonomy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems
  • Space