OBTAINING THIN COPPER-TITANIUM ALLOY FILMS BY VACUUM DEPOSITION,
Abstract
A method is described for preparing thin films of a given compound by the simulataneous evaporation of the components from 2 sources. The rates of evaporation of Cu and Ti were determined experimentally under conditions of vacuum sputtering, and equations are given which describe the dependence of the rate on temperature. The sputtered films are a metastable solid solution of Ti and Cu formed as the result of quenching the vapor on the substrate. The parameter of the solid solution, a equals 3.623 A., indicates that the concentration of dissolved Ti is close to the value given under the sputtering conditions (5 wt. percent). (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1970
- Accession Number
- AD0707295
Entities
People
- A. N. Pilyankevich
- G. K. Abramyan
Organizations
- National Air and Space Intelligence Center