APPLICATIONS OF HOLOGRAPHY TO COMPONENT TESTING.
Abstract
Two new applications of holographic interferometry are presented. The first deals with the detection of bonding voids in rubber-to-mtal, plastic-to-metal, and metal-to-metal laminates. The second application involves a new technique for the determination of the dimensional accuracy of cylinders, such as gun barrel bores. The methods used to detect laminate voids, including acoustical stressing and thermal stressing, are discussed, and results presented. The factors influencing the applicability of holography for barrel bore inspection are discussed, and computer programs used in the system design are included. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1970
- Accession Number
- AD0709603
Entities
People
- J. W. Mcgarvey
- R. D. Schulz
- R. J. Iversen