A GRIDDED THICK FILM METALIZATION STRUCTURE EMPLOYED IN MULTICHIP CIRCUIT FABRICATION

Abstract

The note describes a process to produce a thick film circuit that holds as many as 40 integrated circuit chips and can be produced quickly at reasonable cost. Yield, equipment, materials and circuits are also listed.

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Document Details

Document Type
Technical Report
Publication Date
Aug 04, 1970
Accession Number
AD0710614

Entities

People

  • Helmut H. Pichler

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Air Force
  • Circuits
  • Conductivity
  • Dielectrics
  • Fabrication
  • Films
  • Integrated Circuits
  • Materials
  • Materials Processing
  • Measurement
  • Measuring Instruments
  • Stainless Steel
  • Steel
  • Test Equipment
  • Thick Films
  • Viscosity

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design