FATIGUE CRACK PROPAGATION IN COPPER AND COPPER-ALUMINUM SINGLE CRYSTALS.

Abstract

The effects of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation have been studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. The results were discussed in terms of cyclic hardening and the case of dislocation cross slip. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 27, 1970
Accession Number
AD0711678

Entities

People

  • Hitoshi Ishii
  • Johannes Weertman

Organizations

  • Northwestern University

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Crack Propagation
  • Cracks
  • Crystal Structure
  • Crystals
  • Dislocations
  • Elements
  • Hardening
  • Nitrogen
  • Orientation (Direction)
  • Polycrystals
  • Single Crystals

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.