An Assessment of Surface and Sub-Surface Damage Introduced in Ceramics by Semi-Finish Grinding Operations.

Abstract

The nature and extend of grinding damage introduced by surface grinding a number of ceramics having widely varying mechanical properties was studied. Surface damage was characterized by optical and electron microscopy and subsurface damage was observed using etch pit techniques. Grinding damage was found to depend strongly on wheel type and rate of material removal as well as on the mechanical behavior and microstructure of the workpiece. The results indicate that grinding damage is mainly composed of mixtures of three types depending on the mechanism of material removal. When material is removed efficiently from low impact resistance ceramics (e.g., magnesium oxide and ferrite) the surfaces are generated by brittle fracture and are composed of regions of transgranular and intergranular fracture. When grinding is inefficient; i.e., when the grinding wheel loads up, material is removed by plastic flow. The resultant surfaces on deformable ceramics (e.g., magnesium oxide, ferrite, and silicon) are smooth and burnished but may contain thermal cracks due to the heat generated. In this instance subsurface damage consists of a discrete, highly deformed layer containing cracks in most cases. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1970
Accession Number
AD0714491

Entities

People

  • B. G. Koepke

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Electron Microscopy
  • Electrons
  • Flow
  • Grinding Wheels
  • Magnesium
  • Magnesium Compounds
  • Materials
  • Mechanical Properties
  • Microscopy
  • Microstructure
  • Physical Properties
  • Plastic Flow
  • Resistance

Fields of Study

  • Materials science

Readers

  • Manufacturing Engineering.
  • Structural Health Monitoring of Composite Structures.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics