Reliability Investigation of Thermal Stress/Fatigue Failure in Multilayer Interconnection Boards.
Abstract
Results are reported on the failure mechanisms of multilayer interconnection boards (MIBs) subjected to long-term temperature-cycling tests. The underlying failure process, consisting of low-cycle copper fatigue and leading to circuit open due to fracture, was found to occur at different rates and in different locations as a function of: (1) MIB design geometry and material parameters; (2) manufacturing process parameters; and (3) temperature cycling test profile values. Of particular interest is the presentation of comparative test results showing that straight-wall PTH (plated-through-hole) construction provides somewhat greater resistance to thermal fatigue than does etched-back PTH construction. Results are also given for comparative tests on early-vintage MIBs fabricated using polyimide materials and fluroborate-copper PTH plating. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1970
- Accession Number
- AD0714702
Entities
People
- Harvey C. Hurley
- Malcolm A. Young
- Thomas M. Strong
Organizations
- International Business Machines Corporation (Armonk, NY)