State of the Art of Integrated Circuits

Abstract

Integrated circuits are distinguished from thin-film and hybrid circuits. Current and probable future failure rates, performance, and physical characteristics are described. Yield and its relation to cost are discussed, as are other manufacturing and application considerations. High reliability, smaller size, and the ultimate low cost of high volume production are expected. Because of these factors the use of integrated circuits rather than thin-film circuits is predicted for all cases except the few for which they inherently lack the necessary performance.

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Document Details

Document Type
Technical Report
Publication Date
Sep 10, 1964
Accession Number
AD0717152

Entities

People

  • J. R. Buyan

Organizations

  • The Aerospace Corporation

Tags

DTIC Thesaurus Topics

  • Chemical Reactions
  • Circuits
  • Compound Semiconductors
  • Films
  • High Reliability
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Plating
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Sputtering
  • Substrates
  • Thin Films
  • Transistors
  • Vapor Plating

Readers

  • Computer Engineering
  • Semiconductor Device Technology
  • Systems Analysis and Design