Use of a Reaction Rate Method to Predict Failure Times of Adhesive Bonds at Constant Stress.

Abstract

A reaction rate method was successfully used to predict failure times for adhesive bonds under constant stress at 90-95% and at 50% relative humidity. The method was found to be not very useful when the experiments were performed at 20% relative humidity. The results suggest that the method should be particularly useful under high humidity, bond degrading conditions such as exist in the tropics. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1970
Accession Number
AD0717554

Entities

People

  • David W. Levi
  • Elise Mcabee

Organizations

  • Picatinny Arsenal

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Aluminum
  • Energy
  • Engineering
  • Environment
  • Equations
  • Experimental Data
  • Heat Of Activation
  • High Humidity
  • Humidity
  • Least Squares Method
  • Low Humidity
  • Materials
  • Materials Engineering
  • Mechanical Properties
  • New Jersey
  • Test And Evaluation

Readers

  • Climatology
  • Combustion science or combustion engineering.
  • Surface Coatings Technology.