Prediction of Failure Times of Adhesive Bonds at Constant Stress. 2. Failure at Low Humidity

Abstract

The object of this report was to examine possible methods of applying a reaction rate method to failure times of adhesive bonds at constant stress and low humidity. AF 126 epoxy adhesive and aluminum adherends were used in this study. Two new procedures for estimating kinetic parameters from constastress mechanical data are described. These procedures were applied to data on adhesive bonds obtained earlier. It was found that even for bonds tested at 20% HUMIDITY, CONSISTENT AND REASONABLE RESULTS WERE OBTAINED. By the previously used procedures, this correlation had been very doubtful.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1970
Accession Number
AD0722251

Entities

People

  • David W. Levi
  • Elise Mcabee

Organizations

  • Picatinny Arsenal

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Air Force
  • Air Force Facilities
  • Aluminum
  • Army Aviation
  • Equations
  • Heat Of Activation
  • Humidity
  • Low Humidity
  • Materials
  • Materials Laboratories
  • Military Research
  • Munitions
  • New Jersey
  • Ordnance Laboratories
  • Security
  • Weapons

Readers

  • Fluid Dynamics.
  • Surface Coatings Technology.