UHF MOS Integrated Circuits.

Abstract

Two ceramic carriers were designed and batch fabricated to accommodate beam-leaded UHF MOS transistors. One approach requires a receptacle hole to be formed in the ceramic piece. This approach is attractive because it is ideally adaptable for use in UHF integrated circuits. The other approach is a thick-plate, planar approach that is amenable to large batch fabrication techniques. It too is adaptable for use in UHF integrated circuits but electrical grounding requires detailed consideration. Initial results with the planar approach are very encouraging. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1971
Accession Number
AD0724722

Entities

People

  • Robert H. Dawson

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Electrical Grounding
  • Electronic Equipment
  • Electronics
  • Fabrication
  • Integrated Circuits
  • Semiconductor Devices
  • Solid State Electronics
  • Transistors

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Integrated Circuit Design and Technology.
  • Phased Array Antenna Design.