Hybrid Thin Film Circuits,
Abstract
Based on published data, a general description of hybrid thin-film circuits is given. Circuits with discrete active elements: initial data required for designing such elements is listed. Construction of circuits with discrete active elements: typical structures with and without housing; methods of connections. Topology of the circuits with discrete active elements: sixteen rules for developing the topology are given. Methods of connecting microcircuits with hang-on components: pressure, ultrasonic, and laser welding methods are most widely used for connections. Monolithic thin-film circuits: mounting of active and passive elements on a Si-chip is explained; distinctive features of transistors and planar diodes; volume resistors, diffusion resistors, diffusion capacitors; insulation of chips. Hybrid structures: monolithic circuits combined with semiconductor components; several integrated circuits in one housing. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 29, 1971
- Accession Number
- AD0724980
Entities
People
- S. A. Maiorov
Organizations
- National Air and Space Intelligence Center