Chemical Vapor Deposition

Abstract

The report discusses the chemical vapor deposition of tungsten on a copper substract using tungsten hexafluoride and hydrogen. The crystal properties of the tungsten are mentioned. Microhardness measurements on material deposited at each of 500 and 700C are reported. The morphologies of the fracture faces for all tests were observed with scanning electron microscopy although no pictures are presented in the report. Square holes have been observed in transmission electron microscopic observations of sections parallel to the growing interface. For W-22% Rh alloy it is now thought that observed grain growth rate decreases at longer annealing times are caused by the development of bubbles on the grain boundaries.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1971
Accession Number
AD0725833

Entities

Organizations

  • University of Utah

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Chemical Analysis
  • Chemical Compounds
  • Chemical Vapor Deposition
  • Chemistry
  • Electron Microscopy
  • Grain Boundaries
  • Grain Growth
  • Heat Treatment
  • High Temperature
  • Materials
  • Materials Engineering
  • Materials Science
  • Measurement
  • Metallurgy
  • Powder Metallurgy
  • Tensile Strength
  • Vapor Deposition

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene