Multilayer Printed Wiring Board Design Standard.

Abstract

The relationship between percent resin flow, percent resin retained, percent copper (circuit) retained, and processed thickness has been established and is presented in graph and table form. A basic standardized computer aided design language is described. An outline of the material covered in the recently submitted Design Standard draft is presented. (Author-PL)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1970
Accession Number
AD0725990

Entities

People

  • Walter S. Rigling

Organizations

  • Martin Marietta

Tags

DTIC Thesaurus Topics

  • Computer-Aided Activities
  • Computer-Aided Design
  • Computers
  • Computing Devices
  • Geometry
  • Language
  • Materials
  • Standards
  • Thickness

Readers

  • Library and Information Science
  • Reinforced Composite Materials
  • Software Engineering.