Structure-Property Relationships in Liquid Ceramics.

Abstract

Techniques were developed for measuring the volume change on melting, density, expansivity, surface tension, viscosity, and adiabatic compressibility of molten ceramics to temperatures as high as 3000C. The techniques are extensions of more general methods used to measure liquid properties at lower temperatures. Modifications were made to reflect the severe conditions imposed by the high temperatures. The experimental conditions imposed limitations on the accuracy and precision of the surface tension data. Problems were also compounded by reaction between the sample and the crucible. The data which was obtained for the volume change on melting, density, viscosity, and adiabatic compressibility are quite precise considering the severe temperature conditions. The data for the systems studied are new except for some Al2O3 data. However, more data are required before the data can logically be used to interpret the liquid structures. One problem that was observed several times was the incompatibility of the sample with its container material. The elevated temperatures at melting produced rapid rates of reaction and capsule failure. The composite structures which were produced, however, do show potential promise for high temperature applications such as turbine blades or for electronic applications. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 21, 1971
Accession Number
AD0726401

Entities

People

  • J. Lambert Bates
  • Jewell J. Rasmussen
  • O. Daniel Slagle
  • Richard P. Nelson

Organizations

  • Battelle Memorial Institute

Tags

DTIC Thesaurus Topics

  • Accuracy
  • Composite Materials
  • Composite Structures
  • Compressive Properties
  • Containers
  • Crucibles
  • High Temperature
  • Materials
  • Physical Properties
  • Precision
  • Surface Tension
  • Turbine Blades
  • Turbines
  • Viscosity

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics