Packaging and Placement of Modules in Automated Design of Radio-Electronic Equipment,

Abstract

Various types of algorithms for packaging and placement of modules in microcircuit configurations are discussed. A suitable packaging algorithm is selected and described in detail. Also considered is an algorithm for the placement of modules. The latter algorithm uses a minimum combined wire length and a constrained maximum single-wire length as quality criteria. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 19, 1971
Accession Number
AD0726611

Entities

People

  • A. I. Krapchin
  • A. N. Pokrovskii
  • E. N. Malginov

Organizations

  • National Air and Space Intelligence Center

Tags

DTIC Thesaurus Topics

  • Algorithms
  • Circuit Testers
  • Electronic Equipment
  • Microcircuits
  • Modules (Electronics)
  • Packaging
  • Test Equipment

Readers

  • Applied Combinatorial Optimization and Logic Circuit Design.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics