Conductive, Lusterless Coatings for Light Metals.

Abstract

A process for electrodepositing lusterless, conductive coatings on light metals was developed. The objectives were to (1) identify satisfactory ranges of operating conditions and composition for electroplating lusterless nickel and (2) eliminate zinc and copper undercoats in order to improve corrosion resistance. Ranges were established for the current density and temperature of the porous nickel plating process and for the appropriate concentration of activated carbon to produce a conductive, abrasion-resistant, lusterless coating which is expected to be useful for camouflaging electronic gear in field applications. Representative aluminum electronic hardware parts were plated with the coating. Zinc and copper undercoats were eliminated by depositing nickel adherently on aluminum after it was conditioned anodically in sodium carbonate solution. The results of accelerated corrosion tests indicate improved durability in corrosive atmospheres. Investigation of analogous procedures for plating nickel on magnesium was unsuccessful. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1971
Accession Number
AD0730942

Entities

People

  • Carl H. Layer
  • Glenn R. Schaer
  • William E. Howe
  • William H. Safranek

Organizations

  • Battelle Memorial Institute

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Abrasion
  • Aluminum
  • Atmospheres
  • Carbonates
  • Coatings
  • Corrosion
  • Corrosion Resistance
  • Current Density
  • Deposition (Materials Processing)
  • Electroplating
  • Magnesium
  • Mechanical Properties
  • Metals
  • Physical Properties
  • Plating
  • Resistance

Fields of Study

  • Materials science

Readers

  • Surface Coatings Technology.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene