Fatigue Crack Propagation in Copper and Copper-Aluminum Single Crystals No. 2.
Abstract
The effect of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation was studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. A stress intensity factor was used to normalize the crack propagation data. It was found that dislocation cross slip plays a critical role on the rate of fatigue crack propagation. Existing mathematical crack propagation formulae could not explain the data on single crystals. A new fatigue crack propagation model to explain the observed results is proposed. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1971
- Accession Number
- AD0731413
Entities
People
- Hitoshi Ishii
- Johannes Weertman
Organizations
- Northwestern University