Some Soldering Questions of Refractory Metals,

Abstract

One of the difficulties when soldering molybdenum with oxidized copper by silver solder is the oxidation of the molybdenum and the failure of wetting. The reason for oxidation is the transfer of oxygen from the copper to the surface of the molybdenum, which is confirmed by calculation. The effective means combating the oxidation of the molybdenum is the utilization of a copper foil layer, which creates an obstacle for oxygen transfer and completely eliminates oxidation. When soldering porous metals, especially tungsten, the selection of a soldier should be made considering the strength of its interaction with the material of a porous body. Preliminary calculations in the proposed simplified scheme made it possible to shorten the labor input of experimental operations. A comparison of zirconium and titanium with respect to the time necessary for the crystallization of the soldier in the capillaries of porous tungsten indicated the obvious advantages of titanium. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 27, 1971
Accession Number
AD0732282

Entities

People

  • Yu. S. Dolgov

Organizations

  • National Air and Space Intelligence Center

Tags

Communities of Interest

  • Human Systems

DTIC Thesaurus Topics

  • Materials
  • Metals
  • Molybdenum
  • Oxidation
  • Porous Metals
  • Refractory Metals
  • Silver Solders
  • Soldering
  • Titanium
  • Tungsten
  • Zirconium

Fields of Study

  • Materials science

Readers

  • Plasma Physics.
  • Powder metallurgy of Titanium alloys.
  • Systems Analysis and Design