A Study of Some Parameters Affecting Film Boiling Deposition,
Abstract
A continuation of laboratory work on a process for depositing SiC by film boiling is described. The effects of time and fiber diameter on plating rates were determined empirically. Variations in plating cell geometry, intermediate contacts, and pre-plating treatments on the tungsten substrate were investigated. Eleven additives to the plating fluid were tried and their effects on the quality of the deposit were noted. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1971
- Accession Number
- AD0733304
Entities
People
- Vernon A. Nieberlein
Organizations
- United States Army Aviation and Missile Command