Review of Grumman Studies in Metal Solidification

Abstract

Metals solidification has been observed and practiced for thousands of years, but has been systematically studied only over the past several decades. Only since the rapid advances in the semiconductor industry has metal solidification been more rigorously and quantitatively investigated. It is found that impurities measured in ppm strongly influence the strength and integrity of structural materials as well. The report discusses several unique solidification models and computer solutions to these models which have been developed.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1971
Accession Number
AD0733541

Entities

People

  • Chou Li

Organizations

  • Grumman

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Computer Programs
  • Computers
  • Convection
  • Crystal Growth
  • Diagrams
  • Differential Equations
  • Equations
  • Freezing
  • Materials
  • Phase Diagrams
  • Semiconductor Devices
  • Semiconductors
  • Steady State
  • Temperature Gradients
  • Transition Temperature
  • Transitions
  • Vapor Pressure

Readers

  • Materials Science and Engineering.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics