Multi-Chip Integrated Circuit Package.
Abstract
The objective of the contract is to reduce to practice a compatible multi-chip interconnection system for unpackaged integrated circuits, eliminating insofar as possible wire bonds and interconnection interfaces, and achieving high yield, low cost, and high reliability. A pilot production line was set up in this project to product sufficient units for test and cost evaluation. This project is based on the use of beam-leaded IC's and an air-insulated beam-lead crossover interconnection method. This is the final report on this multi-chip contract. The conclusions and recommendation sections support the basic advantages of the beam-lead system. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1971
- Accession Number
- AD0736790
Entities
People
- Jack Ramsey
- Joe Dimauro
- Kirk Anderson
- Ned Van Buren
- Nino P. Cerniglia