Image Conversion Panel Techniques Using Direct Carrier Injection (Diode Development).

Abstract

Large p-i-n diode structures suitable for use in millimeter wave image conversion panels have been developed. Typical dimensions are 0.25 cm in width by 0.28 cm in length by 0.11 cm in thickness between injecting contacts. Ion implanted arsenic and alloyed aluminum form the n and p junctions, respectively, on 18 kiloohm - cm silicon. Image conversion panels operating at 10 frames/sec and containing up to 1000 diode elements can be constructed using the present diodes. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1972
Accession Number
AD0737345

Entities

People

  • J. M. Baird

Organizations

  • HRL Laboratories

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Conversion
  • Elements
  • Millimeter Waves
  • Thickness

Readers

  • Human-Computer Interaction (HCI).
  • Semiconductor Device Technology

Technology Areas

  • 5G