Reliability of Ceramic Multilayer Boards.

Abstract

The objective of the program was threefold: one, to bring up-to-date the current literature and information presently available in this very new packaging technology of ceramic multilayers; two, to construct a simple circuit of sufficient interwiring density that would require at least four wiring levels and a representative materials technology; and three, a test series that would create sufficient environmental stress to be able to assess the quality of the systems involved. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1971
Accession Number
AD0737373

Entities

People

  • Courtney Furnival
  • John Burt
  • John R. Moore

Organizations

  • Sylvania Electric Products

Tags

DTIC Thesaurus Topics

  • Literature
  • Materials
  • Packaging

Readers

  • Electrical Engineering
  • Systems Analysis and Design
  • Thin Film Deposition Science.