Soldering of Gold Thin Films,
Abstract
Soldering of gold thin films and of gold-plated leads to electronic components has for the past several years been of increasing interest to workers in the field. The author surveys the available literature for the theoretical and practical results and problems of recent work in the field. The phase diagram for the ternary system of gold, tin, and lead is discussed in detail, as are the conditions that generate the various phases, and the factors that affect the strength of soldered joints. Other subjects discussed include the melting and diffusion of gold in tin-lead solders, and the results of studies into the characteristics of soldered joints. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 13, 1971
- Accession Number
- AD0737885
Entities
People
- Gaspar Hedrig
Organizations
- National Air and Space Intelligence Center