High-G Testing of Electronic Components.

Abstract

High-g acceleration produced by large bore guns is compared with impact acceleration. Methods for subjecting electronic components and circuit packages to high-g launch environments up to 550,000-g are outlined and analyzed. An analysis of the effect of the high-g environment on components is performed on a component by component basis. Methods for selecting, 'hardening' and testing components for high-g circuitry are given as are circuit construction and assembly details. An extensive appendix listing type, manufacturer and part number is included for components that have survived high-g environmental testing. Recommendations are made for an improved test program that will yield a new generation of reliable high-g hardened components for circuit design. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1971
Accession Number
AD0738907

Entities

People

  • Samuel Allen Miles Ii

Organizations

  • Naval Postgraduate School

Tags

DTIC Thesaurus Topics

  • Assembly
  • Construction
  • Demographic Cohorts
  • Electronic Components
  • Environment
  • Fabrication
  • Hardening
  • Impact Acceleration
  • Motion
  • Physical Properties

Readers

  • Aerospace Test and Evaluation
  • Business Analytics
  • ballistics.

Technology Areas

  • Microelectronics