A Study of Cyclic Fatigue Damage in Copper-Aluminum Alloys by Thermal Conductivity Measurements
Abstract
Low temperature (4K - 70K) thermal conductivity measurements were carried out on two copper-aluminum (copper plus 1 at. % and 15 at. % aluminum) which have undergone various stages of fatiguing. From the temperature variation of the lattice component of the meausred thermal conductivity, the dominant lattice imperfections introduced by fatiguing were determined. It is found that in the copper plus 1 at. % aluminum alloy, the damage is in the form of dislocation pile-ups. In the copper plus 15 at. % aluminum alloy, the damage is a random distribution of dislocations. This damage is of the same nature as that induced by uniaxial tensile deformation.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1972
- Accession Number
- AD0740593
Entities
People
- Frederick P. Lipschultz
- Tak K. Chu
Organizations
- University of Connecticut