Wire-Bond Electrical Connections: Testing, Fabrication and Degradation- -A Bibliography 1957-1971
Abstract
More than 245 papers relevant to wire-bond type electrical interconnections used in microelectronic and low-power discrete and hybrid devices are listed together with key words. The bibliographic search concentrated on compiling papers which appeared in the period from 1965 to 1970, inclusive. The selection of papers was generally limited to those that were pertinent to wire-bonds where the wire diameter is less than about 50 micron (2 mils) and where the wire is bonded by either thermocompressive or ultrasonic means. Two indexes are provided: (1) an Author Index and (2) a Key Word Index. The latter includes a tabulation of the literature citations.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1972
- Accession Number
- AD0740673
Entities
People
- Harry A. Schafft
Organizations
- National Institute of Standards and Technology