Encapsulation

Abstract

Encapsulation used as a protective covering for electronic circuits, insulation from moisture and heat, and lacquer film and thin film coatings of capacitors, is the subject of the bibliography. References dealing with failures, cracks, and deterioration effects are amply represented. Corporate Author-Monitoring Agency, Subject, Title, and Personal Author Indexes are included.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
May 01, 1972
Accession Number
AD0740990

Entities

Organizations

  • Defense Technical Information Center

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Chemistry
  • Material Degradation Processes
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Modules (Electronics)
  • Plastics
  • Polymeric Films
  • Resins
  • Semiconductors
  • Transducers

Readers

  • Library and Information Science
  • Materials Science and Engineering.
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene