Use of Karbost in Paronit Production,

Abstract

Karbost (a by-product of wood pulping industry) was used for filing Paronit (a sealing compound) based on rubber SKS-30. The new filler has low thermal conductivity coefficient and high electrical resistance (60,000 ohm cm at 20 degrees). Paronit filled with Karbost had greater tensile strength at break than Paronit containing graphite. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 04, 1972
Accession Number
AD0743675

Entities

People

  • E. Z. Shossel
  • I. M. Kanevskii
  • R. I. Feldman

Organizations

  • National Air and Space Intelligence Center

Tags

DTIC Thesaurus Topics

  • Coefficients
  • Conductivity
  • Electrical Resistance
  • Graphitic Materials
  • Physical Properties
  • Production
  • Resistance
  • Sealing Compounds
  • Tensile Strength
  • Thermal Conductivity

Readers

  • Industrial Economics
  • Pavement Materials Engineering.
  • Thin Film Deposition Science.