Corrosive Effects of Solder Flux on Printed-Circuit Boards

Abstract

A number of tactical radio sets have been reported inoperable as a result of lead breakage of transistor and quartz crystals. The location and type of fractures indicated that these leads failed by stress-corrosion cracking. Such failures result from the combined effects of mechanical stress and a mildly corrosive atmosphere. The only source of specific corrodent for this type of failure was chloride ions found in residual flux on printed circuitry. The corrosive effects of the residual flux was demonstrated by the identification of corrosion products found on the printed wiring. Careful selection of the solder flux, scrupulous cleaning of the printed-circuit boards, and conformal coating is recommended for all similar applications.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1971
Accession Number
AD0744617

Entities

People

  • Aubrey J. Raffalovich

Organizations

  • United States Army Communications-Electronics Command

Tags

DTIC Thesaurus Topics

  • Alloys
  • Circuit Boards
  • Corrosion
  • Electronic Equipment
  • Hydrochloric Acid
  • Hydrogen Embrittlement
  • Hydroxides
  • Material Degradation Processes
  • Materials
  • New York
  • Printed Circuit Boards
  • Printed Circuits
  • Semiconductor Devices
  • Stress Corrosion
  • Stress Corrosion Cracking
  • Transistors
  • Water

Readers

  • Electrical Engineering
  • Materials Science (Mechanical Engineering).
  • Surface Coatings Technology.