Polyimide Films for Hybrid Circuits.

Abstract

Polyimide films have a unique combination of properties that makes them ideally suited for hybrid and beam lead substrates. They maintain desirable chemical, electrical, and physical properties over a wide temperature range. Results of studies at APL show that these properties are advantageous in the fabrication of prototype hybrids, such as experimental amplifiers, inductors, and microwave circuits. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1972
Accession Number
AD0745731

Entities

People

  • Robert E. Hicks

Organizations

  • Johns Hopkins University Applied Physics Laboratory

Tags

DTIC Thesaurus Topics

  • Amplifiers
  • Beam Leads
  • Circuits
  • Connectors
  • Fabrication
  • Hybrid Circuits
  • Inductors
  • Microwaves
  • Physical Properties
  • Prototypes
  • Quantum Properties
  • Quantum Yields
  • Substrates
  • Terminals

Readers

  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.