PPQ (Polyphenylquinoxaline) Resin Systems for High-Temperature Composite Materials

Abstract

The subject program has been directed toward the development of the high-temperature resin system, polyphenylquinoxaline (PPQ), based on 3,3'- diaminobenzidine (DAB) and 4,4'-oxybisbenzil (OBB), through the use of a designed trifunctional crosslinking mechanism to provide a unified cured resin system with requisite thermomechanical capability as a laminating resin for end- use application in advanced weapons systems. Linear PPQ composites with Modmor- II carbon fiber reinforcement have displayed RT-flexural strengths as high as 301,300 psi, with residual thermoplasticity, however, at 700F. On the other hand, trifunctionally cured WRD X-361 PPQ homopolymer has demonstrated complete retention of RT-flexural performance in Modmor-II flat laminates at 700F. Each of these copolymer resin compositions could be readily fabricated into Modmor- II laminates exhibiting room temperature flexural strengths in excess of 200,000 psi.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1972
Accession Number
AD0746273

Entities

People

  • Richard T. Rafter
  • Walter P. Fitzgerald Jr.

Tags

Communities of Interest

  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Carbon Fibers
  • Chemical Reactions
  • Composite Materials
  • Copolymers
  • Equations
  • Fibers
  • Filaments
  • Flexural Properties
  • Flexural Strength
  • High Temperature
  • Laminates
  • Materials
  • Mechanics
  • Polymerization
  • Polymers
  • Resins
  • Solvents

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems