Fracture Studies in Silicon Crystals.

Abstract

An X-ray diffraction method was developed to study the plastic and elastic strain distribution of a propagating crack in notched, wedge-shaped silicon crystals deformed by cantilever bending. The method is based on the disturbance of thickness contour fringes (Pendellosung fringes) of dynamically diffracting crystals by lattice defects, generated by the deformation process. The interaction of low-angle boundaries with the strain field emanting from the notch is described. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1972
Accession Number
AD0746275

Entities

People

  • S. Weissmann

Organizations

  • Rutgers University–New Brunswick

Tags

DTIC Thesaurus Topics

  • Absorbers (Materials)
  • Advanced Materials
  • Boundaries
  • Detection
  • Diffraction
  • Engineered Materials
  • Low Angles
  • Materials
  • Thickness
  • X Rays
  • X-Ray Diffraction

Fields of Study

  • Physics

Readers

  • Materials Science (Mechanical Engineering).
  • Optical Physics and Photonics.
  • Thin Film Deposition Science.