Segmented High Average Power Ho(3+) : YLF Laser

Abstract

A novel technique for building disk lasers is described which offers considerable simplification of their design. The laser disk is bonded into a glass Holding ring with Teflon FEP film. Tapering the mating surfaces of the disk and disk holder not only makes assembly possible but also minimizes the effects of different thermal expansion coefficients of the two pieces. Calculations of the maximum fabrication errors and bonding pressures indicated that the technique was, indeed, feasible. A Ho(3+):LiYF4 disk was bonded into a glass slide, verifying these preliminary calculations. Measurements of the transmittance of the bonded surfaces indicate that a very low loss interface is formed due to the nearly equal indicies of refraction of the Teflon film and glass or LiYF4.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1972
Accession Number
AD0747968

Entities

People

  • William C. Fricke

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Absorption Spectra
  • Air Gaps
  • Assembly
  • Coefficients
  • Department Of Defense
  • Electro-Optics
  • Fabrication
  • Films
  • Materials
  • New Hampshire
  • Optical Properties
  • Optics
  • Refractive Index
  • Tensile Properties
  • Tensile Strength
  • Tensile Stress
  • Thermal Expansion

Fields of Study

  • Physics

Readers

  • Optical Physics and Photonics.
  • Surface Coatings Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Directed Energy