Testing and Fabrication of Wire-Bond Electrical Connections - A Comprehensive Survey
Abstract
The fabrication and testing of wire-bond electrical connections used in integrated circuits, hybrid circuits, and low-power discrete semiconductor devices are surveyed comprehensively. The survey is generally restricted to wire-bond electrical connections where the wire diameter is less than 2 mils and where the wire is bonded either by thermocompressive or ultrasonic means. Under the general heading of fabrication, the essential features of the thermocompression and ultrasonic bonding processes, the fabrication procedures, and the characteristics of the constituent materials of the wire bond pertinent to high reliability are surveyed.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1972
- Accession Number
- AD0748788
Entities
People
- Harry A. Schafft
Organizations
- National Institute of Standards and Technology