Nuclear Radiation Hardening for Electronic Components

Abstract

This document comprises a survey of the causes and effects of a radiation environment on various electronic components, and the techniques that must be employed to harden these devices against radiation. In applying radiation hardening techniques to electronic equipment and components, the requirement for such hardening often conflicts with both the equipment's electrical performance and physical requirements. Among these requirements are frequency response, device current ratings, switching speed efficiency, weight and volume (size). Thus tradeoffs must be made. Some guidelines are included here for establishing tradeoffs for specific designs.

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Document Details

Document Type
Technical Report
Publication Date
Aug 25, 1969
Accession Number
AD0750290

Entities

People

  • Eugene R. Hnatek

Organizations

  • Lockheed Martin Missiles and Space

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Cell Physiological Processes
  • Charge Carriers
  • Circuit Analysis
  • Crystal Structure
  • Electronic Components
  • Energy Bands
  • Field Effect Transistors
  • Gamma Rays
  • Integrated Circuits
  • Ionization
  • Ionizing Radiation
  • Modules (Electronics)
  • P-N Junctions
  • Power Electronics
  • Semiconductor Devices
  • Semiconductors
  • Zener Diodes

Fields of Study

  • Engineering
  • Physics

Readers

  • Nuclear and Radiation Engineering.
  • Optical Fiber Sensing and Electromagnetic Propagation.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics