Materials and Interface Factors Limiting LSI (Large Scale Integrated Circuits) Performance and Reliability.

Abstract

Material, chemical, physical, metallurgical and electrical effects in large scale integreated circuits (LSI) and other semiconductor devices are surveyed. Material transport phenomena, thermochemical and electrochemical effects, properties of metallization systems for semiconductor devices and semiconductor surface effects as they affect device performance and reliability are discussed. Eighty-nine references are provided. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1972
Accession Number
AD0750577

Entities

People

  • Robert H. Boschan
  • Thomas C. Hall
  • William G. Brammer

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Electrical Properties
  • Integrated Circuits
  • Large Scale Integrated Circuits
  • Large Scale Integration
  • Materials
  • Metal Oxide Semiconductors
  • Reliability
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Integrated Circuit Design and Technology.
  • Tribology (the study of the boundary interaction between sliding surfaces, lubrication, wear and friction).

Technology Areas

  • Microelectronics