Multilayered Printed-Circuit Assembly,
Abstract
Microminiaturization cuts cost, size, and weight in electronic equipment, but all types of microminiaturization have their individual difficulties. This augments to the point where the volume of conductors to be connected almost becomes as large as the equipment. This resulted in the use of p-c boards, which can be made in many ways, a few of which are described in the report. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 09, 1972
- Accession Number
- AD0750918
Entities
People
- N. N. Ushakov
Organizations
- National Air and Space Intelligence Center