Solder for Connecting Semiconductor Systems with a Metal Base

Abstract

The report concerns solder for connecting semiconductor systems with a metal base having a different thermal expansibility. It is distinguished by the fact that it is composed of 45-90% lead, 1-10% gold and the rest indium.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1972
Accession Number
AD0750948

Entities

People

  • Ivan Soska

Organizations

  • National Air and Space Intelligence Center

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Electrical Properties
  • Foreign Technology
  • Inventions
  • Melting Point
  • Patents
  • Plastic Deformation
  • Resistance
  • Semiconductors
  • Soldering
  • Thermal Expansion
  • Thermal Resistance
  • Thermal Stresses

Readers

  • Artificial Intelligence
  • Electrical Engineering
  • Materials Science and Engineering.

Technology Areas

  • Microelectronics