Investigation of Novel Heat Removal Techniques for Power Transistors.
Abstract
The feasibility of new cooling methods for VHF power transistors capable of providing a reduction in junction temperature of 33%, compared to conventionally packaged devices has been investigated. Design objective for the transistors are a minimum power dissipation of 25 watts CW power from a 28-volt supply with a minimum power gain of 6 dB. The electrical characteristics of the devices are to be within 10% of conventional devices, the volume no more than 4 times, and the weight no more than 5 times that of equivalent hermetically sealed devices. Achievement of these objectives was based on the application of heat pipe cooling techniques to the chip surface, within a standard TO-package. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1972
- Accession Number
- AD0752076
Entities
People
- M. A. Merrigan
Organizations
- Hughes Aircraft Company