Packaged Circuits.
Abstract
Selected references cover such topics as development of principles and techniques of integration and packaging of printed circuits, packaging concepts for uncased integrated circuit systems, advanced electronic packaging techniques, packaging a 30 mc amplifief for airborne use and packaged magnetic digital computer assemblies. Corporate Author-Monitoring Agency, Subject, Title, Personal Author, Contract, and Report Number Indexes are included. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1972
- Accession Number
- AD0752400
Entities
Organizations
- Defense Technical Information Center