Migration of Silver Through Gold Plating on Electrical Contacts

Abstract

An investigation was conducted to determine the extent and composition of migrated silver that had pervaded the gold plate of electrical connector contact pins. An extensive electron microscopic analysis of the form and shapes of the masses of crystalline silver and silver salt accumulations on the gold surfaces is presented. Comparisons are made between the corroded pins and newly produced nickel flash underplated pins.

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Document Details

Document Type
Technical Report
Publication Date
Dec 19, 1972
Accession Number
AD0755123

Entities

People

  • Ronald G. Britton
  • Stewart B. Tulloch

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Cameras
  • Circuit Boards
  • Electron Microscopes
  • Electronic Equipment
  • Energy Levels
  • Engineering
  • Materials
  • Microscopes
  • Migration
  • Photographs
  • Printed Circuit Boards
  • Printed Circuits
  • Radar
  • Radar Equipment
  • Scanning Electron Microscopes
  • X Rays

Readers

  • Electrical Engineering
  • Electrochemical Surface Science
  • Materials Science and Engineering.

Technology Areas

  • Microelectronics