Problems of Reliability of Semiconductor Thermoelectric Devices (Problemy Hadezhnosti Poluprovodnikovykh Termoelektricheskikh Priborov)

Abstract

Various types of thermoelectric devices are considered and their qualitative reliability indices are presented. The area of applicability of the exponential law of the probability density distribution of rejections is described for computations on the devices mentioned. On the basis of an analysis of the quantitative reliability indices, and the design and technological features of the devices, a series of recommendations are given with respect to an increase of the reliability and quality of the devices in question. Rejections are considered which took place during tests and exploitation of the devices, and the most common of them are considered with the object of demonstrating the causes for their occurrence.

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Document Details

Document Type
Technical Report
Publication Date
Dec 27, 1972
Accession Number
AD0756898

Entities

People

  • B. S. Lupanov
  • N. F. Shatalova
  • V. A. Yefimov

Organizations

  • United States Army Foreign Science and Technology Center

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Electrical Circuits
  • Electronic Components
  • Epoxy Compounds
  • Joints
  • Materials
  • Power Supplies
  • Probability
  • Reliability
  • Reliability Engineering
  • Semiconductor Devices
  • Semiconductors
  • Soldered Joints
  • Statistical Data
  • Thermocouples
  • Thermopiles

Readers

  • Information Retrieval
  • Solar Photovoltaics and Thermoelectric Devices.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics