Ultrasonic Beam Lead Bonding Equipment.

Abstract

ED CIRCUIT DEVICE TO A SUITABLE SUBSTRATE. The design, fabrication, and evaluation of a laboratory welder for this application delineated requirements for an experimental ultrasonic beam lead bonder for field evaluation. The experimental unit consisted of a 60-kHz ultrasonic torsional welding system installed in a modified commercial micropositioner which provided x-y positioning of the beam leaded chip and incorporated an optical system with indexing for visual alignment of the chip. The welder accepts electrical power input up to about 50 watts and weld time up to 1.2 seconds; experimental data indicate this capability to be adequate for bonding commercially available beam lead devices. The process represents a practical alternative to current beam lead bonding techniques. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1973
Accession Number
AD0757561

Entities

People

  • Janet Devine

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Beam Leads
  • Connectors
  • Experimental Data
  • Fabrication
  • Laboratory Equipment
  • Laboratory Procedures
  • Substrates
  • Terminals
  • Test And Evaluation
  • Test Equipment

Readers

  • Electrical Engineering
  • Materials Science and Engineering.
  • Metallurgy