Materials Bonding - Ethylene Propylene Rubber

Abstract

Polyethylene, polypropylene, and neoprene are commonly used insulating materials on wire and cable for underwater service, as are stainless steel and beryllium copper for connector hardware. Ethylene Propylene Diene Rubber (EPDM), a synthetic rubber having chemical building blocks in common with polyethylene and polypropylene and physical properties similar to neoprene, has been investigated as a potential tie material between these insulations. An EPDM FORMULATION HAS BEEN DEVELOPED, UTILIZING A PEROXIDE CURE SYSTEM THAT WILL DEVELOP SATISFACTORY PHYSICAL PROPERTIES OVER A CURE TEMPERATURE RANGE COMPATIBLE WITH POLYETHYLENE, POLYPROPYLENE, AND NEOPRENE. This formulation has been molded and cured against samples of these materials as well as stainless steel, and beryllium copper, with various surface treatments, and the adhesion bonding obtained measured quantitatively. Test results indicate that, dependent on surface treatment and cure parameters, a reasonable degree of bonding can be achieved between the EPDM formulation and each of the other materials.

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Document Details

Document Type
Technical Report
Publication Date
Apr 13, 1973
Accession Number
AD0758712

Entities

People

  • Stephen B. King

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesives
  • Alkenes
  • Aluminum Oxides
  • Biomedical And Dental Materials
  • Copolymers
  • Dermatologic Agents
  • Dielectric Polymers
  • Dielectrics
  • Elastomers
  • Ethylenes
  • Flash Point
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Physical Properties
  • Polymeric Films
  • Synthetic Rubber

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Polymer Science and Technology
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics